Message from the Chair of the EMVCo Board of Managers

As we reflect on the year so far, the importance of industry engagement and collaboration in shaping the development of EMV® Specifications is readily apparent.

A Special Interest Meeting (SIM) in June provided an invaluable opportunity to deep-dive into EMVCo’s Electric Vehicle Open Payment (EVOP) initiative, exploring how EMV payment technology can support a simple and consistent card-based payment experience across multiple EV manufacturers and charging stations.  As activity progresses, we are committed to actively encouraging and seeking input from EV industry stakeholders to help ensure an EMV EVOP Specification addresses relevant use cases and requirements.

Direct industry feedback is also shaping EMVCo’s work to promote consistent, convenient and secure payment experiences online and in-store. Interactive resources will help optimise the deployment of both EMV 3-D Secure  and  Click to Pay solutions, while the launch of a new testing process will promote a more seamless experience when consumer and enterprise devices are used to accept contactless payments – known as TapToMobile.

Amid EMVCo’s work to support emerging payments use-cases, it is important to take pause and recognise the enduring success of EMV Chip technology. At the end of 2023, over 13.7 billion EMV Chip cards were in global circulation. EMVCo reported data also reveals that over 70% of issued cards globally are EMV-enabled and nearly 95% of card-present transactions conducted globally used EMV Chip technology.

Next month’s Board of Advisor and Technical Meetings – which will both be held in Lisbon – provide another opportunity for the payments industry to come together to explore how EMV Specifications can continue to support seamless and secure payments across the globe. We look forward to seeing you there.

In the meantime, below is a summary of key EMVCo news, technical updates, educational resources and events from the last quarter. We encourage you to share with your colleagues and industry peers to support understanding of EMVCo’s work.

Soumya Chakrabarty
Chair of the EMVCo Board of Managers, 2024 – 2025


Upcoming Meetings

Associates and Subscribers (*) can register for the following sessions via the EMVCo website.

  • Board of Advisors Meeting, 14-15 October, Lisbon, Portugal
  • Technical Meeting, 16-17 October, Lisbon, Portugal
  • EMV® 3DS Targeted Technology Engagement, 17-18 October, Lisbon, Portugal
  • Board of Advisors Meeting, 4-6 March 2025, Athens, Greece
  • Technical Meeting, 7-10 April 2025, Bangkok, Thailand
  • EMV® User Meeting, 10-11 June 2025, Osaka, Japan

All 2024 meeting dates are listed on the Associate Dashboard.

Not yet an EMVCo Associate? Find out more about how to participate.

*EMVCo subscribers are only permitted to attend EMV User Meetings


News

Exploring EMVCo’s EVOP Initiative

EMVCo is investigating how the wide adoption of the ISO 15118 Standard – which specifies a digital communication protocol between the EV and the charging station – could enable a simple, secure and seamless card-based open payment experience for drivers across charging networks.

Learn more here.

EMVCo Launches New Testing Process to Support the Use of TapToMobile Devices for Contactless Payment Acceptance

The introduction of minimum acceptance criteria and reduced range approval testing addresses the need to enhance the TapToMobile payment experience, enabling EMVCo and industry participants to start measuring the performance of TapToMobile devices and provide feedback on improving read range over time.

Learn more here.

EMVCo Publishes EMV Secure Remote Commerce – Click to Pay Customer Experience (CX) Guidelines

The EMV Secure Remote Commerce – Click to Pay CX Guidelines are a dynamic, interactive tool for merchants, payment service providers, product owners, developers and CX designers who want to make online checkout easier with Click to Pay solutions.

View the guidelines here.


Technical Updates

EMV® Level 3 (L3) Testing Framework – Participant System Guidelines

Provides guidelines to Participant Systems when creating and handling L3 Test Set files and L3 Test Card images.

EMV® 3-D Secure Wrapped-SDK Best Practices

Details recommendations for integrating an existing EMV 3-D Secure (3DS) Default-SDK into a 3DS Requestor (Merchant) Application using hybrid or cross-platform development environments.

EMV® 3-D Secure Attribute Verification Message Extension 

Explains how existing EMV 3DS v2.2.0 and v2.3.1 components can provide additional data related to cardholder attributes such as age, name, country of residence or address for verification.

3DSA Bulletin No.15: Sunset of EMVCo 3DS Approval for 2.1.0

EMVCo confirmed that v2.1.0 of the EMV 3DS Specifications has been sunsetted as of 01 July and testing will be stopped against this version.

EMV® Draft General Bulletin No.60: EMV Contact Chip Features Sunsetting 

EMVCo has worked closely with EMVCo Associates and Subscribers to identify certain EMV Contact Chip Specification features to be sunset with the aim of collectively improving security, optimising the usability of the specifications, simplifying editorial understanding, and removing obsolete or unused features.

EMV® Contactless Specifications for Payment Systems – Book E Cryptography Worked Examples

Book E is a dedicated document that defines the approaches and cryptographic methods – including Elliptic Curve Cryptography (ECC) – to ensure adequate security functionality. EMVCo has now provided worked examples of the security mechanisms described in the document.

Key Length Bulletin No.28: EMVCo Annual RSA Key Lengths Assessment

EMVCo looks at RSA lengths annually and recommends updates. This ongoing review will continue while there is demand within the payments sector.

Learn more about the technical updates on the EMVCo website.


Events

CharIN Testival & Conference Europe

EMVCo’s Director of Technology, Arman Aygen joined a panel with CharIN, KEOLABS and PIONIX to discuss how stakeholders are navigating the EV landscape to ensure a seamless and secure charging experience.

CharIN Testival & Conference North America

EMVCo’s Director of Engagement and Operations, Oliver Manahan took part in a panel discussion with the American Center for Mobility Lincoln Electric, The Best Group and FirstGroup to explore the latest innovations across the EV charging ecosystem.

U.S. Payments Forum Summer Virtual All-Member Meeting

Oliver Manahan explored the evolving landscape of EV payments on a panel alongside Voyager, Giesecke+Devrient and Discover Financial Services.

Netcetera Webinar: ‘Next Level Fraud Prevention with 3-D Secure in APAC’

Arman Aygen joined representatives from Netcetera, Australian Payments Network and Mastercard to discuss e-commerce fraud in the APAC region and the role of EMV 3DS in securing online payments.

Merchant Risk Council San Diego, Members-Only Conference

Oliver Manahan joined a panel with representatives from Arcot, Capital One and Sony Interactive Entertainment to discuss how EMV 3DS can secure online payments.

Merchant Advisory Group Payments Conference

Oliver Manahan discussed the importance of specifications for merchants and the wider payments industry on a panel with X9 and nexo standards.

Don’t miss EMVCo at these upcoming industry events this year:

  • Netcetera Innovation Summit
  • Infineon Banking Day
  • Java Card Forum Webinar
  • TPAC 2024
  • Clarion’s Travel and Transport Payments Week
  • PAN-Nordic Card Association Meeting
  • Discover’s Advanced Payment Summit

Educational Resources and Updates from EMVCo 

Do you have colleagues, partners or customers who would benefit from greater EMV understanding? Check out and share these latest educational resources for insights and information on the role and value of EMVCo and EMV Specifications.

Electric Vehicle Open Payments (EVOP)

EMV Insights

EMVCo Meeting Updates

Podcasts

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EMV® is a registered trademark in the U.S. and other countries and an unregistered trademark elsewhere. The EMV trademark is owned by EMVCo, LLC