3-D Secure Specification v2.3.1

The following documents are applicable to 3DS Specification v2.3.1:

  • EMV 3-D Secure Protocol and Core Functions Specification v2.3.1.1
    • EMV 3-D Secure Specification Bulletin No. 294 – updates, clarifications and errata incorporated since version 2.3.1.0 (May 2023)
    • EMV 3-D Secure Specification Bulletin No. 279 – updates, clarifications and errata incorporated since version 2.2.0 as amended by EMV® 3-D Secure Specification Bulletin No. 214 v3 (August 2023)
  • EMV 3-D Secure SDK Specification v2.3.1.1
    • EMV 3-D Secure Specification Bulletin No. 296 – updates, clarifications and errata incorporated since version 2.3.1.0 (May 2023)
    • EMV 3-D Secure Specification Bulletin No. 280 – updates, clarifications and errata incorporated since version 2.2.0 (August 2023)
  • EMV 3-D Secure Split-SDK Specification v2.3.1.0
    • EMV 3-D Secure Specification Bulletin No. 271 Split-SDK Specification for version 2.3.1.0 (August 2022)
  • EMV 3-D Secure Specification Bulletin No. 255 v3 – Specification Version Configuration (December 2023)

For this version, the specifications include all the latest revisions, and specification bulletins are provided (where applicable) solely as resources reflecting the changes.